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  DE-FOA-0002083 Subsurface Stress and Lost Circulation in Geothermal Drilling Funding Opportunity Announcement (FOA) Geothermal Technologies (GTO) 4/26/2019 05:00 PM ET 6/7/2019 05:00 PM ET

DE-FOA-0002083: Subsurface Stress and Lost Circulation in Geothermal Drilling

DOE’s Geothermal Technologies Office (GTO) will award up to $7M for projects that advance geothermal development by addressing two significant barriers: understanding subsurface state of stress and managing lost circulation events in drilling. Improved understanding of the stress state in geothermal fields will lead to significant cost reductions at several stages of the development cycle, including improved drilling success rates and sustainability of reservoirs over time. Improved knowledge of subsurface stress has the potential to improve both well targeting and reservoir sustainability – two primary drivers of cost. Another challenge that can contribute to the high cost of reservoir access is the loss of fluids to surrounding rock during drilling, or lost circulation events (LCEs). Because geothermal drilling operations tend to target zones of highly fractured and altered material, lost circulation is more common in geothermal drilling than in other applications and can represent 20% of the costs for exploratory wells and reservoir development. Effective assessment of the subsurface stress and being able to mitigate and manage lost circulation events are critical to improving the efficiency of geothermal energy development and ultimately can play a major role in increasing domestic energy affordability. With this funding opportunity, GTO is seeking to sponsor early-stage R&D that will advance the state of the art in each of these related areas.

The full Funding Opportunity Announcement is published at EERE-Exchange.energy.gov.

For questions and answers pertaining to this FOA, please reference the DE-FOA-0002083: Subsurface Stress and Lost Circulation in Geothermal Drilling FAQ Log in FOA Documents.

The eXCHANGE system is currently designed to enforce hard deadlines for Concept Paper and Full Application submissions.

The APPLY and SUBMIT buttons automatically disable at the defined submission deadlines. The intention of this design is to consistently enforce a standard deadline for all applicants.

Applicants that experience issues with submissions PRIOR to the FOA Deadline: In the event that an Applicant experiences technical difficulties with a submission, the Applicant should contact the eXCHANGE helpdesk for assistance (exchangehelp@hq.doe.gov). The eXCHANGE helpdesk and/or the EERE eXCHANGE System Administrators (eXCHANGE@ee.doe.gov) will assist the Applicant in resolving all issues.

Applicants that experience issues with submissions that result in a late submission: In the event that an Applicant experiences technical difficulties with a submission that results in a late submission, the Applicant should contact the eXCHANGE helpdesk for assistance exchangehelp@hq.doe.gov

Documents

  • DE-FOA-0002083 Subsurface FAQs (Last Updated: 7/16/2019 09:58 AM ET)
  • DE-FOA-0002083 Subsurface Stress and Loss Circulation in Geothermal Drilling (Last Updated: 3/27/2019 05:05 PM ET)

Application Forms and Templates

The following forms and templates may be used as part of the application submission. Note that these forms and templates do not necessarily constitute all the documents required for a complete application. Please refer to the 'Application and Submission Information' of the published announcement to learn more about the required application content requirements.

Full Application

  • Statement of Project Objectives (SOPO) (Last Updated: 2/11/2019 03:55 PM ET)
  • Application for Financial Assistance SF-424 (Last Updated: 2/11/2019 02:54 PM ET)
  • Budget Justification Workbook EERE 335 (Last Updated: 2/11/2019 02:55 PM ET)
  • Summary Slide (Last Updated: 2/11/2019 03:59 PM ET)
  • SF-LLL Disclosure of Lobbying Activities (Last Updated: 2/11/2019 03:58 PM ET)

Contact Information

Submission Deadlines

  • Concept Paper Submission Deadline: 4/26/2019 5:00 PM ET
  • Full Application Submission Deadline: 6/7/2019 5:00 PM ET
  • View Full Application Reviewer Comments Period: 7/10/2019 7:00 PM ET – 7/15/2019 5:00 PM ET