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  DE-FOA-0001165 RFI - Advanced Manufacturing Office (AMO) Software Tools Request for Information (RFI) Advanced Manufacturing Office (AMO) TBD

DE-FOA-0001165: RFI - Advanced Manufacturing Office (AMO) Software Tools

This is a Request for Information (RFI) only. Responses to the RFI will be treated as informational only and will not be viewed as a binding commitment for the respondent to develop or pursue the project or ideas discussed. 

The purpose of this RFI is to solicit feedback from industry, academia, research laboratories, government agencies, and other stakeholders on issues related to market opportunities to enhance and expand upon certain AMO system software tools and related assets. At the present time these software tool resources/assets are primarily maintained and managed by the U. S. Department of Energy’s (DOE’s) Advanced Manufacturing Office (AMO). This RFI seeks information to assist with the transition of these resources to be primarily or solely managed by a third party (or parties). AMO is particularly interested in business strategies to ensure:

             The resource content is maintained, improved and enhanced

             The resources remain available to the industrial sector

             The current and future market needs for these system assets are addressed

             Adaptation to rapidly changing and progressing electronic and IT infrastructure is embraced and addressed

Responses to this RFI must be submitted electronically to AMOTools@go.doe.gov  with a subject line “Response to RFI” no later than 5:00pm (EDT) on September 30, 2014.   Responses must be provided as a Microsoft Word document (.docx or .doc) of no more than 8 pages in length, 12 point font, 1 inch margins as an attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. Only electronic responses will be accepted.

Documents

  • FULL TEXT: RFI - AMO Software Tools (Last Updated: 7/23/2014 03:35 PM ET)

Contact Information

Submission Deadlines

  • Full Application Submission Deadline: TBD